Hardware/FPGARackEdison
(Difference between revisions)
(→On-board USB communication) |
(→On-board USB communication) |
||
Line 26: | Line 26: | ||
The board can host up to 5 [http://ark.intel.com/products/84572/Intel-Edison-Compute-Module-IoT Intel Edison compute modules]. | The board can host up to 5 [http://ark.intel.com/products/84572/Intel-Edison-Compute-Module-IoT Intel Edison compute modules]. | ||
− | == On-board | + | == On-board communication == |
− | The FPGA connects to each compute module with an | + | The FPGA connects to each compute module individually with: |
+ | * a serial port | ||
+ | * a SPI link | ||
+ | * an [http://www.ftdichip.com/Products/ICs/FT232H.htm USB FIFO] circuit | ||
== VME connection == | == VME connection == |
Revision as of 11:05, 24 November 2015
|
Board Overview
Type | FPGA Rack | Schematic | User constraints file | Description |
---|---|---|---|---|
V1.0 | FPGA Rack Edison v1.0 | FPGA-Rack Edison v1.0 Schematic PDF | TBD | 5 Intel Edison Compute Modules and Microsemi AGL1000 FPGA |
The board is compatible with the FPGA Rack Backplane for interconnecting different boards with the help of the HES-SO Backplane Bus and the HES-SO VME IP Core. Some restrictions due to IOs availablity are shown in the following chapter.
Hardware features
The board comprises a controller FPGA and Linux microprocessor systems. It is tailored for low-power, real-time image processing.
Intel Edison compute modules
The board can host up to 5 Intel Edison compute modules.
On-board communication
The FPGA connects to each compute module individually with:
- a serial port
- a SPI link
- an USB FIFO circuit
VME connection
The VME connector at the back is compatible with the HEI Backplane Bus, making it compatible with the other HEI VME rack components. The Edison cluster board can thus be used for controlling an instrument built out of these devices.
On-board logic levels
TBD
Programmation
TBD