Hardware/FPGARackEdison

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(On-board USB communication)
(On-board USB communication)
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The board can host up to 5 [http://ark.intel.com/products/84572/Intel-Edison-Compute-Module-IoT Intel Edison compute modules].
 
The board can host up to 5 [http://ark.intel.com/products/84572/Intel-Edison-Compute-Module-IoT Intel Edison compute modules].
  
== On-board USB communication ==
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== On-board communication ==
  
The FPGA connects to each compute module with an individual [http://www.ftdichip.com/Products/ICs/FT232H.htm USB FIFO] circuit.
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The FPGA connects to each compute module individually with:
 +
* a serial port
 +
* a SPI link
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* an [http://www.ftdichip.com/Products/ICs/FT232H.htm USB FIFO] circuit
  
 
== VME connection ==
 
== VME connection ==

Revision as of 11:05, 24 November 2015

Contents

Board Overview

FPGA Rack Edison V1.0 3D view FPGA Rack Edison V1.0 PCB layout FPGA Rack Edison V1.0 photo

Type FPGA Rack Schematic User constraints file Description
V1.0 FPGA Rack Edison v1.0 FPGA-Rack Edison v1.0 Schematic PDF TBD 5 Intel Edison Compute Modules and Microsemi AGL1000 FPGA

The board is compatible with the FPGA Rack Backplane for interconnecting different boards with the help of the HES-SO Backplane Bus and the HES-SO VME IP Core. Some restrictions due to IOs availablity are shown in the following chapter.

Hardware features

The board comprises a controller FPGA and Linux microprocessor systems. It is tailored for low-power, real-time image processing.

Intel Edison compute modules

The board can host up to 5 Intel Edison compute modules.

On-board communication

The FPGA connects to each compute module individually with:

  • a serial port
  • a SPI link
  • an USB FIFO circuit

VME connection

The VME connector at the back is compatible with the HEI Backplane Bus, making it compatible with the other HEI VME rack components. The Edison cluster board can thus be used for controlling an instrument built out of these devices.

On-board logic levels

TBD

Programmation

TBD

Datasheets

Internal links

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