Hardware/FPGARackHiRADDAV1

(Difference between revisions)
Jump to: navigation, search
m (Contacts / Collaborators)
m (Contacts / Collaborators)
Line 134: Line 134:
 
'''Project manager :'''
 
'''Project manager :'''
 
* [[User:Cof|François Corthay]]
 
* [[User:Cof|François Corthay]]
'''Schematics/Design :'''
+
'''Design/Schematics :'''
 
* [[User:Gal|Alexandre Ganchinho]]
 
* [[User:Gal|Alexandre Ganchinho]]
 
'''PCB routing :'''
 
'''PCB routing :'''
Line 144: Line 144:
 
* [[User:Moj|Joseph Moerschell]] (HiRADDA Core : ADC/DAC/Power zone check + HiRADDA Power)
 
* [[User:Moj|Joseph Moerschell]] (HiRADDA Core : ADC/DAC/Power zone check + HiRADDA Power)
 
* [[User:Mlo|Louis Mayencourt]] (HiRADDA Core : Fast general check)
 
* [[User:Mlo|Louis Mayencourt]] (HiRADDA Core : Fast general check)
 
+
'''VHDL/SpinalHDL dev & physical tests :'''
 +
* [[User:Gal|Alexandre Ganchinho]]
  
 
[[Category:Hardware]] [[Category:FPGARack]]
 
[[Category:Hardware]] [[Category:FPGARack]]

Revision as of 10:35, 28 April 2016

Contents

The main purpose behind this board is to have a powerful development FPGA board specialized in high-resolution data acquisition and processing.

Type FPGA Rack Documentation Description
V1.00
Restricted access
Full documentation
Kintex7 XC7K160T-xFFG676

The HiRADDA set is composed of two or more boards :

  • HiRADDA Core
  • HiRADDA Power
  • n x user extension boards

HiRADDA is compatible with the FPGA Rack Backplane for interconnecting different boards with the help of the HVME16/32 version of the HES-SO Backplane Bus and the HES-SO VME IP Core. Additional specific hardware can be connected to HiRADDA as stackable mezzanine card.

HiRADDA embeds multiples memories for different usecases : DDR3 SDRAM for high speed sampling/processing, FLASH for non-volatile data (including softcores code) and Ferroelectric/Magnetoresistive RAM for non-volatile user parameters/logs.

HiRADDA Core V1.00 PCB 3D View

Core features

Main board

This 160x100mm (Eurocard) 16 layers PCB contains the following parts :

  • 2x A/D 24bits 4MSPS (Ti ADS1675) with 2 analog paths :
    • Direct (differential)
    • Through operational amplifier (single/differential)
  • 1x D/A 16bits 500MSPS (Maxim MAX5888), current source, with 1 analog path :
    • Direct (differential)
  • 1x Xilinx Kintex7 XC7K160T-xFFG676 (XC7K70T/XC7K325T compatible)
    • 162.24k logic cells, 25.35k slices (max 2.188Mb of distributed RAM)
    • 11.7Mb block RAM (650x18Kb / 325x36Kb)
    • 600 DSP Slices
    • GTX I/Os
  • 1x Low-jitter clock generator/distributor for ADC/DAC/DDR3/FPGA (AD9517-4 with 1.6GHz VCO)
  • 1x 100MHz quartz for boot clock
  • 1x expansion connectors with the following FPGA banks :
    • Full HR bank 13 (with 24 diffs or 48 single-ended + 2 single-ended, total 50 pins / Voltage range : 1.14V to 3.465V).
    • Full HP bank 33 (with 24 diffs or 48 single-ended + 2 single-ended, total 50 pins / Voltage range : 1.14V to 1.89V).
    • Full GTX banks 115 & 116 (8x TX ,8x RX, 4x reference clocks) - for PCI-Express 8x, SATA, SFP etc... use.
  • 1x additional connector with 8 I/Os (+3.3V).
  • 1x fully isolated USB2.0<->UART interface with hardware flow control.
  • 1x additional connector with isolated 2x input and 2x output (reduce some UART functionnalities if used).
  • Various memories for work/parameters :
    • 1x 256MiB DDR3 (32M x 8banks x 8bit width)
    • 2x 32MiB Serial QuadSPI NOR Flash (one reserved for FPGA programming, bigger compatible ones available)
    • 1x 256KiB Serial SPI Ferroelectric-RAM (pin compatible Magnetoresistive-RAM can be soldered too, bigger compatible ones available)
  • 4x user RGB LEDs
  • 10x user DIL switches
  • 1x JTAG connector
  • 1x DIN41612 VME compatible connector 3x32 pins (full HVME32, 1.8V/2.5V/3.3V) with CMOS AC termination on all signal pins (default: unsoldered)

Power supply considerations

The following power rails have to be produced on the HiRADDA Power board :

  • +C2.5V (AD9517-4)
  • +C3.3V (AD9517-4)
  • -A5.0V - Optional, for AOP input range extension
  • +A1.0V - Optional, for FPGA GTX I/Os.
  • +A1.2V - Optional, for FPGA GTX I/Os.
  • +A1.8V - Optional, for FPGA GTX I/Os.
  • +A3.3V (MAX5888)
  • +A5.0V (ADS1675)
  • +D1.0V (FPGA Core)
  • +D1.5V (DDR3 SDRAM Core)
  • +D1.8V - Optional, for user I/Os
  • +D2.5V (LVDS VCXO, user I/Os)
  • +D3.0V (ADS1675)
  • +D3.3V (multiple usage, incl. user I/Os)

The following power rails are produced locally on the core board :

  • +DR0.75V (DDR3 SDRAM Core)
  • +AR2.5V (ADC)
  • +AR3.0V (ADC)

VME connector considerations

  • No power rail are connected to the VME connector.
  • The I/O bank which interfaces the VME connector can be 1.8V, 2.5V or 3.3V depending on the jumper XXX position. Be careful with other FPGA Rack boards different voltage configuration.

Programming

The FPGA on this board can be programmed in 2 ways :

  • directly through JTAG interface.
  • automatically on boot via the onboard FLASH memory. This serial FLASH can be accessed in :
    • SPI SDR x1 : ~20s boot time
    • SPI SDR x4 : ~ 5s boot time
    • SPI DDR xn is not supported.

More explanation about FLASH programming is available here.

Changelog / Known issues

Validated functions on PCB version 1.00 :

  • [PASS] FPGA and JTAG
  • [PASS] FPGA boot via SPIx4 FLASH
  • [PASS] FPGA boot oscillator.
  • [PASS] AD9517-4 clock generator/distributor (include heavy configuration though SPI).
  • [PASS] MAX5555 DAC
  • [PASS] ADS1675 ADC CH0 and CH1 via AOP (bipolar power).
  • [FAILED] User FRAM (see issues).
  • [PENDING] DDR3 (see issues).
  • [TODO] User FLASH.
  • [TODO] User I/Os.
  • [TODO] User GTXs.

Issues for PCB version 1.00 :

  • [Non critical] FPGA VCCBRAM is routed to +A1.0V instead of +D1.0V. Must be bridged to +D1.0V through the filter LC21.
  • [Non critical] Error in PCB layout for the F/M-RAM IC : can't be soldered. Please add one (or two) SPI version through I/O port J6. See patch A.
  • [Enhancement] Light overshoot on ADC 32MHz CMOS input clocks. Better to add a termination.
  • [Information] LVPECL DAC clock must be only pulldowned, then decoupled (no bridge/diff term at end).
  • [Critical] Errors around DDR3 power supplies. [Corrections on patch A]
    • +D1.5VF is not connected to +D1.5V (filter missing!). DDR3 is NOT powered.
    • MAX1510ETB's VCC is connected to +D1.5VF instead of +D3.3V. Can't work.
    • MAX1510ETB's PGOOD (open-drain) pullup resistor is missing (so the tiny testpoint is useless).
    • MAX1510ETB's REFIN is accidentally bridged to +D1.5VF.
    • C127 is useless (must be connected to +D1.5VF).
  • [Non critical] FPGA Bank 34. T7 (MISCIO_SWITCH8) VRP pin must be pulled up with 100Ohms and U4 (MISCIO_SWITCH0) VRP pins pulled down with the same value. This is for DCI inputs (data lane). Therefore these SWITCH I/Os are no more usable (maybe cut concerned pins for avoid "on-demand" DDR3 crash ^^).
  • [Information] DDR3: Below 400MHz operations, FPGA internal reference is activable. At higher frequency, you will be frustrated with W4 (MISCIO_BUTTON0), AD3 (DDR3-TDQS_N) and even more with Xilinx MIG7 coregen util...
  • [Information] Phantom signals on bank 14 (K23 DAC1_PD and J23 DAC1_SEL0). To know for another revision.

Planned changes for PCB version 1.10 :

  • F/MRAM good IC layout.
  • Pulldown terms on DAC LVPECL clock at the end of the line (and simplification of front elements).
  • DDR3 regulator full review (patch A integration).
  • VRP/VRN resistors on DDR3 dedicated bank.
  • Add external VREF on DDR3 dedicated bank for a 2x datarate enhancement (bonus).
  • FPGA VCCBRAM to +D1.0V.
  • CMOS AC terminations on ADC clocks.
  • Less bright blue / RGB LEDs (max 1mA!) ;-)
  • Add reset manager for HiRADDA Core usage without HiRADDA Power board ?

Contacts / Collaborators

This board was initially targeted for Dominique Roggo's and Joseph Moerschell's projects.

Project manager :

Design/Schematics :

PCB routing :

Additionnal checks :

VHDL/SpinalHDL dev & physical tests :

Personal tools
Namespaces
Variants
Actions
Navigation
Browse
Toolbox