Hardware/FPGARackEdison

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(VME connection)
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The board is compatible with the [[Hardware/FPGARackBackplane|FPGA Rack Backplane]] for interconnecting different boards with the help of the [[Standards/HEVs_'VME'_Backplane_Bus|HES-SO Backplane Bus]] and the [[Components/IP/VME|HES-SO VME IP Core]]. Some restrictions due to IOs availablity are shown in the following chapter.
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The board comprises a controller FPGA and Linux microprocessor systems.
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It is tailored for low-power, real-time image processing.
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The board is compatible with the [[Hardware/FPGARackBackplane|FPGA Rack Backplane]] for interconnecting different boards with the help of the [[Standards/HEVs_'VME'_Backplane_Bus|HES-SO Backplane Bus]] and the [[Components/IP/VME|HES-SO VME IP Core]].
  
 
= Hardware features =
 
= Hardware features =
 
The board comprises a controller FPGA and Linux microprocessor systems.
 
It is tailored for low-power, real-time image processing.
 
  
 
== Intel Edison compute modules ==
 
== Intel Edison compute modules ==
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* a SPI link
 
* a SPI link
 
* an [http://www.ftdichip.com/Products/ICs/FT232H.htm USB FIFO] circuit
 
* an [http://www.ftdichip.com/Products/ICs/FT232H.htm USB FIFO] circuit
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Additionally, the FPGA connects to a general purpose 24-pin connector and to a VME backplane connector.
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The 24-pin connector is foreseen for interfacing a camera.
  
 
== VME connection ==
 
== VME connection ==
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* parallel bus: A7 ÷ A0, D15 ÷ D0, en, wr, ready, freeze, mode
 
* parallel bus: A7 ÷ A0, D15 ÷ D0, en, wr, ready, freeze, mode
 
* SPI bus
 
* SPI bus
 
= On-board logic levels =
 
TBD
 
  
 
= Programmation =
 
= Programmation =

Revision as of 09:10, 26 November 2015

Contents

Board Overview

FPGA Rack Edison V1.0 3D view FPGA Rack Edison V1.0 PCB layout FPGA Rack Edison V1.0 photo

Type FPGA Rack Schematic User constraints file Description
V1.0 FPGA Rack Edison v1.0 FPGA-Rack Edison v1.0 Schematic PDF TBD 5 Intel Edison Compute Modules and Microsemi AGL1000 FPGA

The board comprises a controller FPGA and Linux microprocessor systems. It is tailored for low-power, real-time image processing. The board is compatible with the FPGA Rack Backplane for interconnecting different boards with the help of the HES-SO Backplane Bus and the HES-SO VME IP Core.

Hardware features

Intel Edison compute modules

The board can host up to 5 Intel Edison compute modules.

On-board communication

The FPGA connects to each compute module individually with:

  • a serial port
  • a SPI link
  • an USB FIFO circuit

Additionally, the FPGA connects to a general purpose 24-pin connector and to a VME backplane connector. The 24-pin connector is foreseen for interfacing a camera.

VME connection

The VME connector at the back is compatible with the HEI Backplane Bus, making it compatible with the other HEI VME rack components. The Edison cluster board can thus be used for controlling an instrument built out of these devices.

Connected signals are:

  • parallel bus: A7 ÷ A0, D15 ÷ D0, en, wr, ready, freeze, mode
  • SPI bus

Programmation

TBD

Datasheets

Internal links

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