Inventory/CPU/Intel
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+ | == [[Edison Modules - Key features]] == | ||
+ | Small, powerful, and adaptable hardware | ||
+ | • High performance, dual-core CPU and single core micro-controller supports complex data collection in a low power package. | ||
+ | |||
+ | • Integrated Wi-Fi, Bluetooth Low-Energy* (LE), memory, and storage simplifies configuration and increases scalability. | ||
+ | |||
+ | • 40 multiplexed GPIO interfaces with expansion board options for total project design and flexibility. | ||
+ | |||
+ | Software compatibility | ||
+ | • The Intel® IoT Developer Kit for Intel® Edison development platform adds C, C++, Python, and JavaScript support for developing connected sensor Internet of Things applications. | ||
+ | |||
+ | • Supports a variety of integrated development environments such as Arduino*, Eclipse*, Wyliodrin*, and Intel® XDK. | ||
+ | |||
+ | Supportive environment | ||
+ | • Managed online community for project ideas and engagement with other product users. | ||
+ | |||
+ | • Intel product-expert support and open source community software tools. | ||
+ | |||
+ | • Access to device-to-device and device-to-cloud connectivity framework to enable cross device communication and a cloud based, multi-tenant, time-series analytics service. | ||
+ | |||
+ | Key technical features | ||
+ | At the center of the Intel® Edison board is an Intel® Atom™ 22nm SoC with a dual-core CPU at 500Mhz and a MCU at 100Mhz. This allows the product to collect and preprocess data via the MCU in a low power state and hand the filtered data off to the CPU for analytics. The Intel® Edison board includes 1GB of memory, 4GB of storage and dual-band Wi-Fi and Bluetooth* 4.0 for communications. It supports 40 GPIOs with multiple configuration options. | ||
+ | |||
+ | [[http://www.intel.com/content/www/us/en/do-it-yourself/edison.html | Intel Edison Platform]] | ||
+ | |||
== [[Edison Modules]] == | == [[Edison Modules]] == | ||
+ | [[File:intel_edison_r.jpg]] | ||
{|class=wikitable | {|class=wikitable | ||
|- | |- | ||
! Kit number || Stock Location || Usage Location / User || Problems || Remarks || Operating system | ! Kit number || Stock Location || Usage Location / User || Problems || Remarks || Operating system | ||
|- | |- | ||
− | | 01 || | + | | 01 || AE01 || Steve Gallay || - || - || Yocto release 1 |
|- | |- | ||
| 02 || A307 || Mikael Follonier || - || - || Yocto release 2 | | 02 || A307 || Mikael Follonier || - || - || Yocto release 2 | ||
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== [[Edison Breakout boards]] == | == [[Edison Breakout boards]] == | ||
+ | [[File:intel_breakout_r.jpg]] | ||
{|class=wikitable | {|class=wikitable | ||
|- | |- | ||
Line 19: | Line 46: | ||
| 01 || A307 || Mikael Follonier || - || - | | 01 || A307 || Mikael Follonier || - || - | ||
|- | |- | ||
− | | 02 || | + | | 02 || AE01 || Steve Gallay || - || - |
|- | |- | ||
|} | |} | ||
== [[Edison Arduino boards]] == | == [[Edison Arduino boards]] == | ||
+ | [[File:intel_arduino_r.jpg]] | ||
{|class=wikitable | {|class=wikitable | ||
|- | |- |
Latest revision as of 13:44, 24 March 2015
Contents |
Edison Modules - Key features
Small, powerful, and adaptable hardware • High performance, dual-core CPU and single core micro-controller supports complex data collection in a low power package.
• Integrated Wi-Fi, Bluetooth Low-Energy* (LE), memory, and storage simplifies configuration and increases scalability.
• 40 multiplexed GPIO interfaces with expansion board options for total project design and flexibility.
Software compatibility • The Intel® IoT Developer Kit for Intel® Edison development platform adds C, C++, Python, and JavaScript support for developing connected sensor Internet of Things applications.
• Supports a variety of integrated development environments such as Arduino*, Eclipse*, Wyliodrin*, and Intel® XDK.
Supportive environment • Managed online community for project ideas and engagement with other product users.
• Intel product-expert support and open source community software tools.
• Access to device-to-device and device-to-cloud connectivity framework to enable cross device communication and a cloud based, multi-tenant, time-series analytics service.
Key technical features At the center of the Intel® Edison board is an Intel® Atom™ 22nm SoC with a dual-core CPU at 500Mhz and a MCU at 100Mhz. This allows the product to collect and preprocess data via the MCU in a low power state and hand the filtered data off to the CPU for analytics. The Intel® Edison board includes 1GB of memory, 4GB of storage and dual-band Wi-Fi and Bluetooth* 4.0 for communications. It supports 40 GPIOs with multiple configuration options.
Edison Modules
Kit number | Stock Location | Usage Location / User | Problems | Remarks | Operating system |
---|---|---|---|---|---|
01 | AE01 | Steve Gallay | - | - | Yocto release 1 |
02 | A307 | Mikael Follonier | - | - | Yocto release 2 |
03 | A307 | Mikael Follonier | - | - | Ubilinux Debian |
Edison Breakout boards
Kit number | Stock Location | Usage Location / User | Problems | Remarks |
---|---|---|---|---|
01 | A307 | Mikael Follonier | - | - |
02 | AE01 | Steve Gallay | - | - |
Edison Arduino boards
Kit number | Stock Location | Usage Location / User | Problems | Remarks |
---|---|---|---|---|
01 | A307 | Mikael Follonier | - | - |